Thermal Performance Analysis for Optimal Passive Cooling Heat Sink Design
Abstract: Recent advances in
semiconductor technology show the improvement of fabrication on electronics
appliances in terms of performance, power density and even the size. This great
achievement however led to some major problems on thermal and heat distribution
of the electronic devices. This thermal problem could reduce the efficiency and
reliability of the electronic devices. In order to minimize this thermal
problem, an optimal cooling techniques need to be applied during the operation.
There are various cooling techniques have been used and one of them is passive
pin fin heat sink approach. This paper focuses on inline pin fin heat sink,
which use copper material with different shapes of pin fin and a constant 5.5W
heat sources. The simulation model has been formulated using COMSOL
Multiphysics software to stimulate the pin fin design, study the thermal
distribution and the maximum heat profile.
Author: Nur Warissyahidah
Badrul Hisham
Journal Code: jptkomputergg170069
